D-MAX DMC-20SEC Bedienungsanleitung PDF herunterladen (Seite 12)

Manufacturer TRI Innovation

Model

TR7530 S3016 S3054QC

Field of view (orthogonal

camera) [pixel]

1024 x 768 2752 x 2048 @ 55 x 43 mm 672 x 512

Pixel size (orthogonal

camera) [µm]

10; 15; 20 22; 10 22; 10

Number of cameras

(orthogonal)

1 4 1, 2 or 4

Resolution (angled view

camera) [µm/pixel]

n.a. 15 n.a.

Number of cameras (angled

view)

n.a. 4 n.a.

Illumination

ultra-low angle, multi-

segment, RGB LED

lighting

n.a. n.a.

Inspection speed

72 sq. cm/sec @ 20 µm;

40 sq. cm/sec @ 10 µm;

18 sq. cm/sec @ 10 µm

typical connector with 100 pins

15 sec

typical connector with 100 pins

15 sec

Board size max. [mm]

400 x 300 430 x 406 443 x 406

Board size min. [mm]

50 x 50 n.a. n.a.

Board weight max. [kg]

3 n.a. n.a.

Conveyor height [mm]

n.a. 850 - 960 850 - 960

Board edge clearance [mm]

3 3 3

Board clearance top [mm]

25 50 15

Board clearance bottom

[mm]

40 35 50

Applicability

missing component,

tombstone, billboard,

polarity, skew, marking,

defective, insufficient and

excess solder, bridge,

trough hole pin, lifted

lead, golden finger,

scratch, blur

selective and special solder

joints

selective and special solder

joints

Viscom

Table 5. Comparison of Post Soldering Inspection (PSI) machines

Materials Science - Advanced Topics398

1 2 ... 7 8 9 10 11 12 13 14 15 16 17 ... 55 56

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