D-MAX DMC-20SEC Bedienungsanleitung PDF herunterladen (Seite 17)

Manufacturer

Model

Inspection capacity

typical

Board size max.

[mm x mm]

Board size min.

[mm x mm]

Board warp [mm]

Board clearance

top [mm]

Board clearance

bottom [mm]

Board thickness

[mm]

Board weight max.

[kg]

Dual lane capable

Conveyor height

[mm]

Agilent

Technologies

Medalist SJ50

Series 3

41 sq. cm/sec @ pre-reflow;

32 sq. cm/sec @ post reflow

510 x 510 50 x 50 n.a. n.a. n.a. 0.5 - 4.0 3 Yes n.a.

Agilent

Technologies

Medalist SJ50

Series 3 XL

41 sq. cm/sec @ pre-reflow;

32 sq. cm/sec @ post reflow

620 x 620 75 x 50 n.a. n.a. n.a. 1.5 - 15 13 n.a. n.a.

Agilent

Technologies

Medalist

sj5000

41 sq. cm/sec @ pre-reflow;

32 sq. cm/sec @ post reflow

510 x 510 50 x 50 n.a. n.a. n.a. 0.5 - 4.0 3 Yes n.a.

Amistar

Automation Inc.

K2 0.25 sec/screen 330 x 250 50 x 50 + 0.5; - 1.0 28 25 0.5 - 2.0 n.a. n.a. n.a.

Amistar

Automation Inc.

K2L 0.25 sec/screen 485 x 410 50 x 50 + 0.5; - 1.0 28 25 0.5 - 2.0 n.a. n.a. n.a.

CyberOptics

Flex HR 8 50 sq. cm/sec 203 x 508 110 x 63 ± 0.7 32 3 n.a. n.a. n.a. 813 - 965

CyberOptics

Flex HR 12 50 sq. cm/sec 305 x 508 110 x 63 ± 0.7 32 3 n.a. n.a. n.a. 813 - 965

CyberOptics

Flex HR 11 50 sq. cm/sec 457 x 508 110 x 63 ± 0.7 32 3 n.a. n.a. n.a. 813 - 965

Machine Vision

Products

Ultra IV 90 sq. cm/sec 500 x 546 n.a. n.a. n.a. n.a. n.a. n.a. n.a. n.a.

Mirtec

MV-7 4.94 sq. mm/sec 350 x 250 50 x 50 n.a. 25 - 45 50.8 n.a. n.a. n.a. n.a.

Mirtec

MV-7L 4.94 sq. mm/sec 500 x 400 50 x 50 n.a. 25 - 45 50.8 n.a. n.a. n.a. n.a.

Mirtec

MV-7xi 4.94 sq. mm/sec 510 x 460 50 x 50 n.a. 25 - 45 50.8 n.a. n.a. n.a. n.a.

Mirtec

MV-7U 4.94 sq. mm/sec 660 x 510 50 x 50 n.a. 25 - 45 50.8 n.a. n.a. n.a. n.a.

Omron

VT-RNS-S

0.25 sec/screen @ 10 sq. mm

field of view

510 x 460 50 x 50 n.a. 20 - 40 40 - 50 n.a. n.a. n.a. n.a.

Omron

VT-WIN II 0.40 sec/screen 460 x 510 50 x 50 n.a. 50 50 0.3 - 4.0 n.a. n.a. n.a.

Saki

BF-Frontier 24 sec/screen 460 x 500 50 x 60 ± 0.2 40 40 0.6 - 2.5 n.a. n.a. max. 900

Saki

BF-Planet-X 23 sec/screen 250 x 330 50 x 60 n.a. 20 30 0.6 - 2.5 n.a. n.a. max. 900

Viscom

S3088-III 20 - 40 sq. cm/sec 508 x 508 n.a. n.a. 35 40 n.a. n.a. n.a. 850 - 960

Viscom

S3088-II 20 - 40 sq. cm/sec 450 x 350 n.a. n.a. 35 40 n.a. n.a. n.a. 850 - 960

Viscom

S6056-ST1 20 - 40 sq. cm/sec 457 x 356 n.a. n.a. 35 60 n.a. n.a. n.a. 830 - 960

Viscom

S6056-DS1W 20 - 40 sq. cm/sec 457 x 356 n.a. n.a. 35 60 n.a. n.a. n.a. 830 - 960

Viscom

S6056-DS2W 40 - 80 sq. cm/sec 457 x 356 n.a. n.a. 35 60 n.a. n.a. n.a. 830 - 960

Vi Technology

3K Series 4 - 20 ms 458 x 406 50 x 50 n.a. 34 34 0.7 - 4.0 3 Yes n.a.

Vi Technology

5K Series 4 - 20 ms 533 x 533 50 x 50 n.a. 34 60 0.5 - 4.0 3 n.a. n.a.

Vi Technology

7K Series 4 - 20 ms 533 x 610 50 x 50 n.a. 34 60 0.5 - 4.0 3 Yes n.a.

Vi Technology

Vi-5000 4 - 20 ms 508 x 458 50 x 50 n.a. 34 40 0.7 - 5.0 7 n.a. n.a.

Vi Technology

Vi-5000-2 4 - 20 ms 508 x 458 50 x 50 n.a. 34 40 0.7 - 5.0 7 n.a. n.a.

Vi Technology

Vi-5000-3 4 - 20 ms 508 x 458 50 x 50 n.a. 34 40 0.7 - 5.0 7 n.a. n.a.

YES Tech

YTV-F1 35 sq. cm/sec 560 x 510 n.a. n.a. 50 50 n.a. n.a. n.a. n.a.

YES Tech

YTV-F1S 35 sq. cm/sec 560 x 510 n.a. n.a. 50 50 n.a. n.a. n.a. n.a.

YES Tech

YTV-M1 35 sq. cm/sec 350 x 250 50 x 50 n.a. 25 50 n.a. n.a. n.a. max. 950

Table 10. Comparison of Universal Automatic Optical Inspection (UAOI) machines

Assuming that the component is fully operational, these systems practically are able to prove

that the whole circuit board is working correctly thus replacing the ICT. However, because

they are usually connected to SPC (Statistical Process Control) servers, they can also provide

much information about the SMT process itself and provides help as to how to improve it.

But of course there are disadvantages to using AOI systems. They are not able to inspect hidden

failures such as soldered BGA (Ball Grid Array) bumps and usually the parameters of

inspection algorithms cannot be adjusted perfectly. So from time to time they do not detect

real failures which are called ‘slip-through failures’. These are the most significant malfunc‐

tions during the operation of AOI systems because in these cases, they fail to do what they

were programmed for. So the number of slip-throughs must be zero and - if they arise - close

investigation is necessary to prevent and eliminate them. However if this occurs repeatedly,

Automatic Optical Inspection of Soldering

http://dx.doi.org/10.5772/51699

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