
results in a darker image and in the case of observation along the z axis (from above), as is
typical of microscopes, only the surfaces that are parallel to the horizontal are illuminated. We
also modelled both of these different types of illumination using the Direct3D software.
What follows is a comparison of the images made using the optical microscope and the graphic
representations rendered with Direct3D that most closely replicated the actual light and
surface conditions. Where not indicated separately, the soldered joint (at the SMT resistors) is
illuminated with scattered light.
Figure 17. Photograph and graphic representation of empty solder pad covered in lead-free solder (BF imaging)
Figure 18. Photograph and graphic representation of empty solder pad covered in lead-free solder (DF imaging)
Automatic Optical Inspection of Soldering
http://dx.doi.org/10.5772/51699
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