
Type of measurement result Lead-based solder paste Lead-free solder paste
Measured surface roughness (RMS) 0.03092 0.0986
Distribution of measured RMS value 0.004451 0.054626
Table 11. Measured surface roughness values
At first glance the measured surface roughness values appear realistic; the surface roughness
of the lead-free solder turned out to be approximately three times that of the lead-based solder.
The distribution of the roughness values for the lead-based solder was below 1%, which is
satisfactory because the divergence between the shape of the actual solder and that modelled
by the computer showed a greater error (a few percent), and because greater fluctuation than
this can be expected to result from the differing heat profiles, printed circuit boards or solder-
handling requirements of real production lines. The distribution of the surface roughness
values for the lead-free solder was over 5%, which is due to diversity of the size and shape of
the surface protrusions that appear with this type of solder, which the Cook-Torrance model
handles using statistical simplification, by assuming the surface to be of a consistent roughness.
7.3. Simulation created with the computer model
We checked the measured surface roughness values by comparing the images made using
optical microscopes with the computer-generated graphic representations. The Surface
Figure 15. SEM image of a cross-section of a lead-free solder meniscus
Automatic Optical Inspection of Soldering
http://dx.doi.org/10.5772/51699
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