
[61] S. C. Richard, The Complete Solder Paste Printing Processes, Surface Mount Technol‐
ogy, Vol. 13, 1999, pp. 6-8
[62] Peter Krippner, Detlef Beer, AOI Testing Position in Comparison, Circuits Assembly,
April 2004, pp. 26-32
[63] David P. Prince, Bridge Detection in the Solder Paste Print Process, 1st January 2006,
http://www.speedlinetech.com/docs/Bridge-Detection-Solder-Paste.pdf (accessed 12
July 2009)
[64] K. Fauber, S. Johnson, 2D Versus 3D Solder Paste Inspection http://
www.agilent.com/see/aoi 2003 (accessed 12 July 2009)
[65] Rita Mohanty, Vatsal Shah, Paul Haugen, Laura Holte, Solder Paste Inspection Tech‐
nologies: 2D-3D Correlation, Proceedings of the APEX Conference, April 2008
[66]
R. R. J. Lathrop, Solder Paste Print Qualification Using Laser Triangulation, IEEE
Transactions on Components, Packaging, Manufacturing Technology, Vol. 20, 1997,
pp.174-182
[67] Okura, M. Kanai, S. Ogata, T. Takei, H. Takakusagi, Optimization of Solder Paste
Printability With Laser Inspection Technique, Proceedings ot the IEEE/CPMT Inter‐
national Electronics Manufacturing Technology Symposium, 1997, pp. 361-365
[68] E. H. Rideout, Lowering Test Costs With 3-D Solder-Joint Inspection, Test Measure‐
ment World, Vol. 10, 1990, pp. 744-1657
[69] Y. K. Ryu, H. S. Cho, New Optical Measuring System for Solder Joint Inspection, Op‐
tics and Lasers in Engineering, Vol. 26, No. 6, April 1997, pp. 487-514
[70] H. Tsukahara, Y. Nishiyama, F. Takahashi, T. Fuse, M. Ando, T. Nishino, High-Speed
3-D Inspection System For Solder Bumps, Proceedings of SPIE, Vol. 2597, 1995, pp.
168-177
[71] J. L. Horijon, W. D. Amstel, F. C. Couweleer, W. C. Ligthart, Optical System of an In‐
dustrial 3-D Laser Scanner for Solder Paste Inspection, Proceedings of SPIE, Vol.
2599, 1995, pp. 162-170
[72] T. Xian, X. Su, Area Modulation Grating for Sinusoidal Structure Illumination on
Phase-Measuring Profilometry, Applied Optics, Vol. 40, 2001, pp.1201-1206
[73] Hsu-Nan Yen, Du-Ming Tsai, Jun-Yi Yang, Full-Field 3-D Measurement of Solder
Pastes Using LCD-Based Phase Shifting Techniques, IEEE Transactions on Electron‐
ics Packaging, Manufacturing, Vol. 29, No. 1, January 2006, pp. 50-57
[74] XinYu Wu, WingKwong Chung, Hang Tong, A New Solder Paste Inspection Device:
Design and Algorithm, IEEE International Conference on Robotics and Automation.
Roma, Italy, 10-14 April 2007, pp. 680-685
[75] Fang-Chung Yang, Chung-Hsien Kulo, Jein-Jong Wing, Ching-Kun Yang, Recon‐
structing the 3D Solder Paste Surface Model Using Image Processing and Artificial
Materials Science - Advanced Topics
432
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